Selamat Datang
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E-JOURNAL
Investigation of the flip-chip package with BCB underfill for W-Band applications
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| ID Publisher | : 0000009595 | |
| Nama Jurnal | : IEEE Microwave And Wireless Components Letters ( A Publication Of The IEEE Microwave Theory And Techniques Society )
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| Pengarang | : Chin-Te Wang, Li-Han Hsu, Wei-Cheng Wu, Heng-Tung Hsu, Edward Yi Chang, Yin-Chu Hu, Ching-Ting Lee, Szu-Ping Tsai | |
| Subjek | : Benzocyclobutene (BCB), flip-chip packaging, millimeter-wave, reliability, W-band | |
| Edisi | : 24 / 1 / Januari 2014 |
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