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E-JOURNAL

Ultrawide Bandwidth Chip-to-Chip Intervonneccts for III-V MMICs



  ID Publisher : 0000007169
  Nama Jurnal : IEEE Microwave And Wireless Components Letters ( A Publication Of The IEEE Microwave Theory And Techniques Society )
  Pengarang : Patrick Fay, David Koop, Tian Lu, David Neal, Gray H.Bernstein, and Jason M. Kulick
  Subjek : Interconnects, Millimeter-wave, MMIC pack aging, quit packaging.
  Edisi : 24 / 1 / Januari 2014


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