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Fluid Structure Interaction Numerical Simulation of Wiresweep in Electronics Packaging



  ID Publisher : 0000013436
  Nama Jurnal : Jurnal TELKOMNIKA (Telekomunikasi Komputasi Elektronika Kendali)
  Pengarang : Dadan Ramdan, Usman Harahap, Andi Rubiantara, Chu Yee Khor
  Subjek : Fluid Structure Interaction, MpCCI, Castro-Macosco model, Epoxy Molding Compound, Volume of Fluid, Wire Sweep.
  Edisi : 14 / 1 / Maret 2016


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